BPG8155
BPG8155 PCI Express Backplane
Key Features
- Dual-Processor SBC Options
- PCI Express 3.0 Interfaces
- Multiple x16 PCIe Slots
- Compact 14-Slot Form Factor
The BPG8155 PCI Express Backplane
The BPG8155 PCI Express backplane, when paired with a PCIe 3.0 capable single board computer like the BXT7059, delivers PCIe Gen3 link speeds and expanded I/O card bandwidth to military computing, industrial automation, medical, telecommunications and GPU computing applications. This backplane supports one PICMG® 1.3 single board computer and up to twelve PCI Express I/O cards. Eleven of these option card slots are PCIe 3.0 capable. Each option card slot uses a x16 PCIe mechanical connector to maximize system design flexibility by supporting a wide range of standard PCI Express I/O cards.
The PCIe 3.0 link design of the BPG8155 PCI Express backplane supports a x16 PCIe Gen3 link from Trenton’s BXT7059 system host board as well as future PCIe Gen3 SHBs. The backplane’s two, 16-port/64-Lane Gen3 switches deliver PCIe 3.0 links to option card slots PCIe2 through PCIe12 while PCIe1 is driven with a PCIe 2.0 link from the SHB. The switches and the BXT7059 automatically establish communications with either PCI Express 3.0, 2.0 or 1.1 option cards. All option card slots utilize x16 mechanical connectors. Card slots PCIe5 and PCIe9 are driven with x16 electrical links while card slots PCIe2, 6 and PCIe12 are driven with x8 electrical links. Card slots PCIe3, 4, 7, 8, 10 and 11 are driven with x4 PCIe 3.0 links. PCIe1 is a slot driven with a x4 interface from the SHB’s B0 link. The BPG8155 backplane has a right angle ATX/EPS and two 12V AUX power connectors plus a terminal block to meet expanded system power demands.
PCIe links integrated into the CPUs on the BXT7059 SBC automatically match an option card’s PCI Express link type and speed via the interface’s built-in auto-training capability. This SBC and backplane design feature maximizes system flexibility by enabling system support for standard PCI Express 3.0, 2.0 or 1.1 option cards having various PCIe electrical interfaces such as x16, x8, x4 and x1 PCIe links.
Key features of the BPG8155 PCI Express Backplane include:
- Ideal PCI Express backplane for PCIe Gen3 video processing and GPU computing
- Features multiple x16, x8 and x4 PCI Express 3.0 option card slots
- Twelve total PCIe option card slots available in PCI Express backplane applications
- 2 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
- 3 – x8 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
- 6 – x4 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
- 1 – x4 PCI Express 2.0/1.1 electrical / x16 mech. connector
- Two state-of-the-art 16-port/64-lane PCIe Gen3 switches ensure fast and reliable option card-to-SBC data communications
- Backplane routing and PCIe Gen3 switch design minimizes data latency while maximizing data throughput and bandwidth
- Long life cycle with 7+ year backplane availability
Tech Specs
Model Number
BPG8155
Form Factor
14-slot form factor supports one PICMG 1.3 single board computer and up to twelve PCI Express option cards. All card slots use x16 PCIe mechanical connectors. The backplane’s two 16-port/64-lane Gen3 switches deliver PCI Express 3.0 electrical interfaces to eleven of the backplane’s twelve slots.
Mechanical
Board dimensions: 12.3” x 12.9” with a minimum drive tower cut-out of 14.53 square inches
The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.
Configuration
The twelve available PCI Express option card slots on the BPG8155 backplane are configured as follows:
2 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors
3 – x8 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors
6 – x4 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors
1 – x4 PCI Express 2.0/1.1 electrical / x16 mechanical connector (Note: This slot is driven by SBC link B0)
Optional PCIe link expansion via and IOB33 module is not supported on the BPG8155 backplane; however, an IOB33 may be used on the SHB strictly for added system I/O interface capability such as RS232 serial ports, See the IOB33 page for more details on I/O expansion capability.
Note 2:
Optional PEX10 module is not supported on the BPG8155 backplane.
Note 3:
Backplane slot PCIe1 operates as PCIe 2.0/1.1 slot.
Note 4:
PCI Express link training is fully supported on the BPG8155 backplane. This allows any PCIe card to function in any backplane slot. PCI Express 3.0 link speeds are possible in all backplane slots except PCIe2. This limitation may change with future single board computer designs.
Size
12.3″ x 12.9″ (14-slot)
Card Slots
PCIe5 and PCIe9 – x16 PCI Express 3.0/2.0/1.1 elect./x16 mech. slots
PCIe2, PCIe6 and PCIe12 – x8 PCI Express 3.0/2.0/1.1 elec./x16 mech. slots
PCIe3, PCIe4, PCIe7, PCIe8, PCIe10 and PCIe11 – x4 PCI Express 3.0/2.0/1.1 elect./x16 mech. slots
PCIe1 – x4 PCI Express 2.0/1.1 elect./x16 mech. slot
(Note: The PCIe1 card slot is driven by SBC link B0)
*PCIe1 and PCIe2 slot functionality requires a dual-processor SHB equipped with an optional PEX10 link expansion module
Suggested SHB/SBC’s
BXT7059
SHB Configuration
A PICMG 1.3 single board computer; such as the Trenton BXT7059, ensures that all card slots are active and being driven with the maximum number of PCI Express 3.0 electrical interfaces possible.
Power Connectors
ATX/EPS power source – one right-angle 24-position ATX/EPS connector
+12V AUX power source – two right-angle 8-position connectors
Extended power source – one 10-position terminal block to supply additional power if needed
Power Indicators
+5V, +5V AUX, +3.3V, +12V, +1.8V, and +0.9V power status LEDs
Environmental
Operating Temp: 0°C to 60°C
Storage Temp: -20° to 70°C
Humidity: 5% to 90% non-condensing
The BPG8155 is a lead free, RoHS compliant backplane.
Downloads
Options
Single Board Computers
BXT7059
