The HDB8237 HDEC Series Four Segment Backplane
In addition to the native x16 PCIe link for each HDB8237 backplane segment’s option card slot, the dual Intel® Xeon® E5-2680 v3 processors available on an HEP8225 HDEC Series system host board provides a combined 24-cores of processing capacity. The combination of backplane segment features and system integration capabilities enables innovative cluster computing designs for today’s demanding embedded computing, and data security applications in military computing, industrial automation, and medical diagnostics applications.
Key features of the HDB8237 HDEC Series Four Segment Backplane include:
- A building block for four-in-one military computers, industrial automation and medical diagnostics solutions
- Four total PCIe 3.0 option card slots available:
- 1 – x16 PCI Express 3.0 electrical / x16 mech. connectors in each segment
- Four total HDEC Series system host board slots available:
- 1 – HDEC Series system host board slot in each segment
- Numerous device I/O connections within each backplane segment simplifies system integration, and cable routing
- 4 – SATA/600 connectors
- 2 – USB3 interface header connections
- 4 – Rear chassis USB2 interface ports
- 1 – Rear chassis Serial port
- 4 – System fan headers with built-in fan speed monitoring
- Ideal large format backplane for supporting standard 5U rackmount computer chassis
- Long life cycle with 7+ year backplane availability.
The HDB8237 HDEC Series Four Segment Backplane is designed and manufactured in the USA, and backed by our 5-year factory warranty.
HDEC Series large format backplane has four independent computing segments. Each backplane segment supports a dual-processor HDEC Series SHB and a x16 PCI Express option card. A cluster computing system built with the HDB8237 can support up to four independent SHB and PCI Express cards. All card slots are designed for the Gen3 PCIe electrical interface and are equipped with x16 PCIe mechanical connectors.
Board dimensions: 16.4″/417mm x 12.9″/328mm
The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.
Four segment backplane with one x16 PCI Express card slot, and one HDEC Series system host board slot in each backplane segment
Each backplane segment’s PCIe slot is driven with a native PCIe 3.0 link direct from the processors on a compatible HDEC Series system host board; such as Trenton’s HEP8225, plugged into the segment’s SHB slot.
16.4″/417mm x 12.9″/328mm
4 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors (one per backplane segment)
The following device I/O and system status connections are available within each backplane segment when using an HDEC Series system host board like the HEP8225.
4 – SATA/600 system headers
2 – USB3 interface system header connections
1 – System fan header
4 – ACPI control headers (PSON, PWRBTN, RESET, PWRGD
1 – Clear CMOS header
1 – I2C header allows access to all four segments
1 – Alarm status headers for the FAN signals (backplane segment 2 location
The following LED SHB and system status indicators are available within each backplane segment:
1 – System fan present LED
1 – System Host Board present LED
4 – Incoming system power status LEDs for the 3.3V, 5V, 12V and 5V AUX supply levels
Any compatible HDEC Series, dual-processor system host board including Trenton’s HEP8225.
Agency Approvals & Compliance
Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994
Each backplane segment contains the following system power supply connections:
ATX/EPS power source – one right-angle or vertical 24-position ATX/EPS connector
+12V AUX power source – one right-angle or vertical 8-position connectors
The following LED power indicators are available within each backplane segment:
+5V, +5V AUX, +12V, and +3.3V system power connection and status
Operating Temp: 0°C to 50°C with standard cooling solution and 350LFM of continuous airflow
Airflow: 350LFM continuous airflow
Storage Temp: -40° to 70°C
Humidity: 5% to 90% non-condensing
Trenton’s HDB8237 is a lead free, RoHS compliant backplane.