TML Single Board Computer

Key Features

  • Low-Power Intel Core 2 Duo
  • Low Profile Cooling Solutions
  • DDR2-667 Memory Interfaces
  • PCIe 1.1 and PCI Interfaces

The TML Single Board Computer

The TML single board computer features low power, dual-core and single-core processor options that maximize the SBC’s processing power per watt efficiency. This PICMG® 1.3 single board computer offers power efficiency, performance and value. The TML supports x16, x4 and x1 PCI Express links, and a 32-bit/33MHz PCI interface to a PICMG 1.3 backplane.

The TML handles a wide range of system option cards, from the latest x16 PCI Express video cards to legacy 32-bit/33MHz PCI cards. Pairing the Intel® Core© 2 Duo Processor with the Intel® 945G MCH and the Intel® ICH7R ICH enables us to deliver capabilities needed for demanding computing applications.

Key features of the TML single board computer include:

  • Designed for low-voltage applications where power efficiency is a prime consideration
  • Passive heat sink option provides excellent shock and vibration results
  • Supports PCIe, PCI-X, PCI or ISA option cards plus additional PCIe, PCI-X and PCI cards
  • Graphics-class board with PCI Express x16 and x4 lane support for backplane devices
The TML single board computer maximizes ROI with long-life, embedded components which drive an extended SBC product availability of seven years or more.  As with all Trenton single board computers, the TML is designed with a standard BIOS version that is maintained under strict revision control.

However, BIOS flexibility is built in by offering various BIOS modifications that may be needed to meet unique system requirements.  The TML is designed, manufactured and supported in the U.S. and is covered by our exclusive five-year warranty.


Tech Specs

Model Number


Form Factor

PICMG 1.3 Graphics Class (PCI Express links = one x16 and one x4 or four x1)


1 – Intel Core 2 Duo-T7400 -or-
1 – Intel Core Duo-T2500


Intel® Core™ 2 Duo Processor T7400 – Dual-core, 2.16GHz, 667MHZ FSB, 4MB L2 cache
Intel® Core™ Duo Processor T2500 – Dual-core, 2.0GHz, 667MHZ FSB, 2MB L2 cache

*other processor options are available with non-embedded support

BIOS (Flash)



The Intel® 945G Chipset with the Intel® ICH7R I/O Controller Hub


DDR2-667, 4GB max.


1 – x16 and one x4/4 – x1  (All links 1.1, Edge connectors A&B)
2 – 10/100/1000Base-T (I/O Bracket)
1 – 10/100 (Edge conn. C)


4 – SATA/300 ports with RAID
8 – USB interfaces
1 – VGA Analog Video
1 – IOB33


4GB (Max), Dual channel DDR2-667 interface with two sockets

Video Interface

Intel® Graphics Media Accelerator 950

Ethernet Interfaces

Intel® 82563EB Ethernet controller – Two 10/100/1000Base-T on I/O bracket connector
Intel® 82562G  Ethernet controller – One 10/100 Base-T interface routed to SHB edge connector “C”

On-Board Interfaces

Eight USB 2.0 ports – Two I/O bracket, Two routed to SHB edge connector “C”, Four via on-board header

Four SATA II/300 interfaces with RAID 0, 1, 5 and 10 support – four on board headers

One Ultra ATA/100 interface


Lithium – CMOS data retention


TML Dimensions = 13.330″ (33.858cm) L x 4.976″ (12.639cm) H
Passive Cooling Solution Height = .78″ (1.98cm)
Active Cooling Solution Height Range = 1.18″ (3.00cm) to 1.34″ (3.39cm)


Designed for UL60950, CAN/CSA C22.2 No. 60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

Mean Time Between Failures (MTBF)

MTBF = 198,407 Power-On Hours (POH) at 40 Cº per Belcore

Power Requirements – 100% stressed

100% Stressed via MS Windows HCT’s System Stress

CPU +5V +12V +3.3V
2.16GHz 3.00A 3.20A 2.60A
2.0GHz* 3.00A 2.00A 2.60A

Power Requirements  – Idle

Typical Values – System Idling In Windows XP Desktop

CPU +5V +12V +3.3V
2.16GHz 2.20A 1.70A 2.60A
2.0GHz 2.20A 0.75A 2.60A
*Check Technical Reference Manual for additional processor speeds and system parameters/notes.

Operating Temperature

Operating Temperature: 0° to 55° C.
Airflow Requirement: 350LFM continuous airflow when using the passive heat sink
Storage Temperature: -20° to 70° C
Humidity: 5% to 90% non-condensing

System Hardware Monitor

Monitor Voltages, Fan Speed and Temperature





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